Alumina ceramic substrate has excellent thermal properties, microwave properties, mechanical properties and other advantages, as an electronic component in high frequency switching power supply, semiconductor, IGBT, LED, LD, and other packaging circuit board applications more and more widely. With the rapid development of 5G and high-frequency communication, the demand for high-frequency chip resistors and high-frequency circuit board ceramics is increasing, resulting in a rapid increase in the demand for high-purity alumina substrates. High purity alumina substrate is mainly based on military enterprises, the largest supplier is: Japan Kyocera, Germany and so on. Europe and the United States have imposed sanctions on China, and Japan's Kyocera has explicitly refused to sell to military companies; Domestic military enterprises have an urgent hope for localization; According to the GII report, the global market for ceramic substrates in 2020 is estimated to be $6.6 billion, with a compound growth rate of 6% from 2020 to 2027 and $10 billion expected in 2027.
Ceramic substrate is a commonly used electronic packaging substrate material. Compared with plastic and metal substrates, ceramic substrate has the following advantages:
Advantages
1) Good Insulation
Generally speaking, the higher substrate resistance, the better reliability of the package. Ceramic materials are generally covalent bond compounds with better insulation properties.
2) Low Dielectric Coefficient and Good Frequency Performance
The low dielectric constant and dielectric loss of ceramic materials can reduce the signal delay time and increase the transmission speed.
3) Small Coefficient of Thermal Expansion (CTE)
Covalent bond compounds generally have high melting point, and the higher the melting point, the smaller the thermal expansion coefficient, so the CTE of ceramic materials is generally small.
4) High Thermal Conductivity
Ceramic substrate materials are widely used in high-reliability, high-frequency, high-temperature resistance, and strong air-tight product packaging in aviation, aerospace and military engineering. The packaging of ceramic substrate materials is generally a multilayer ceramic substrate package, which is widely used in hybrid integrated circuit (HIC) and multi-chip module (MCM) ceramic packages.
Simple intruduction of manufactuing process: Tape Casting and Gel Casting.
Metallized Ceramic Substrate
Why Metallization is Necessary on the Surface of Ceramic Substrates?
We need to realize electrical connections through the ceramic substrate. Therefore, the surface of the ceramic substrate needs to be metallized, and then the surface pattern is completed by the method of image transfer.
Metallization is a crucial part of the production of ceramic substrates, because the wetting ability of metals on ceramic surfaces at high temperatures determines the bonding force between metals and ceramics, which is an important guarantee for the stability of packaging performance.
Therefore, how to implement metallization on the surface of ceramic substrates and improve the bonding force between the two has become the focus of research by many scientists.
Where are Ceramic Circuit Boards Mainly Used?
1. LED field
2. High power semiconductor module
3. Semiconductor cooler
4. Electric heater
5. Power control circuit
6. Power hybrid circuit
7. Smart power components
8. High frequency switching power supply
9. Solid state relay
10. Automotive electronics
11. Aerospace and military electronic components
12. Solar panel modules
